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Technological possibilities

Item Processingcapacity Detailed Description Example
Layers Single / double / 4 layers / 6 layers / 8 layers Layers, it refers to the number of layers in the PCB Electrical (Copper layers) also refers to the layers of design documents.
Sheet type
Full fiberglass (FR4),
aluminum plate 94V0
Full fiberglass (FR-4) 94V0 cardboard (Kingboard KB6160A and international A-class) aluminum plate
Board size 110 * 55 cm Generally allow customers most PCB design large size 110cm * 55cm, conventional within 54cm * 48cm, specific to the file audit subject, beyond the press extended to increase board fees.
Dimensions Accuracy ±0.15mm Dimensions acceptable range (difference)
Thickness range 0.2 - 3.5mm The current production of thickness 0.2 / 0.4 / 0.6 / 0.8 / 1.0 / 1.2 / 1.6 / 2.0 / 2.5 / 3.0 / 3.5
Thickness tolerance
(T≥1.0mm)
±10% The thickness of the acceptable range: for example, the thickness T = 1.6mm, the physical thickness of 1.44mm (T-1.6 × 10%) ~ 1.76mm (T + 1.6 × 10%)
Minimum line width 0.1mm
Line width should be greater than 0.1mm.
Notlessthan 0.1mm.
Minimum clearance 0.1mm
Possible distance should be greater than 0.1mm.
Notlessthan 0.1mm.
Width / line spacing tolerance ±20%mm Guarantee is not higher than the industry standard
Finished outer copper thickness
1oz~3oz
(35um~105um)
Default conventional circuit board outer copper line thickness 1oz, most do 3oz (required under the single Remarks).
Finished inner copper thickness
0.5oz~2oz
(18um~70um)
Default conventional circuit board outer copper line thickness 0.5oz, most do 2oz (required under the single Remarks).
Hole copper thickness/td> 18-22um Not fall below industry standards
Drilling aperture 0.2-10mm The minimum diameter drills 0.2mm, the largest drilling tool diameter 6.0mm, if greater than 6.0mm factory reaming process, in order to meet customer requirements specifications for the 0.05mm machine drills to the first order, such as 0.3mm, 0.35mm, 0.4mm ....
Unilateral welding ring ≥0.1mm The conductive plug hole or holes unilateral solder ring is too small, but where there is a large enough space is not to limit the size solder ring unilateral; such as where there is no space large enough and dense traces, the minimum unilateral solder ring may not be less than 0.1mm.
Hole tolerance (Machine drilling) ±0.08mm Drilling tolerance for ± 0.08mm, for example, is set to 1.0mm hole, objects plate finished hole is qualified in 0.92--1.08mm allowed.
Solder type Photosensitive ink Photosensitive ink is now the most used type, the current color: dark green, matt green, blue, dumb blue, red, yellow, black, matte black, white.
Minimum character width 0.13mm The minimum width of the character, if less than 0.13mm, physical board may be due to design reasons caused the characters are not clear.
Minimum character height ≥1mm The minimum character height, if less than 1mm, physical board may be caused due to design characters are not clear.
Surface Treatment Surface spraying Currently Extension Chi Electronics HASL surface processes that lead HASL, HASL, ENIG, immersion silver, anti-oxidation (OSP), bare copper lead HASL: the conventional process, by spraying attached to a layer in the copper surface solder. Non-environmentally friendly processes. HASL: conventional process, with leaded HASL. But as environmental technology. Than leaded HASL slightly higher cost. Immersion Gold: the conventional process, by way of an auxiliary chemical displacement gold in copper surface layer of nickel. As environmental technology, welding requirements applicable to a relatively high board, expensive. Shen Silver: unconventional processes. With Immersion Gold principle. Cost slightly lower than Immersion Gold. Antioxidant (OSP): Unconventional processes. In the copper-thick adhesive layer of protective film copper surface activation. Environmental protection technology and low cost. But the storage time should not be too long. Bare copper: unconventional process, that in the board without any spraying process directly exposed copper surface.
Plate spacing and shape inside PAD ≥0.25mm Gongs board ship, alignment PAD line layer board outline from a distance not less than 0.25mm; V cut puzzle shipments, traces PAD V cut from the centerline distance not less than 0.4mm.
V-CUT size ≥80mm V-CUT puzzle board length and width of not less than 80MM, otherwise the production difficulties, CNC V-CUT minimum size 10MM (NC V need to increase the difficulty of fees).
Semi-hole technology minimum diameter 0.8mm Semi-hole process is a special process, the smallest diameter of not less than 0.8mm. Otherwise hole wall copper will be taken away gongs knife, causing the hole wall without copper (this increases the cost of the process and therefore increase)
BGA pad ≥0.3mm Less than 0.3MM BGA pad design can not produce, after etching the pad is too small will lead to poor PCB board finished welding and machine performance.
Solder resist layer window ≥0.075mm Solder is usually always say green oil, with the exception of strong customer requirements, and the system has a single remark requires otherwise do solder bridges.
Via plug hole Less than 0.5mm Vias and pads cover the requirements of the oil ink plugging holes (impervious white) (This step increases so additional costs).
Design Software Support
PADS versions
99SE versions
DXP versions
CAD versions
Sprint-Layout
genesis
CAM350
U-CAM
Gerber
Support within the industry and a variety of software designed to convert gerber files

Technological possibilities

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